EMP112 Просмотр технического описания (PDF) - Excelics Semiconductor, Inc.
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EMP112 Datasheet PDF : 3 Pages
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UPDATED 02/06/2006
ASSEMBLY DRAWING
EMP112
5.0 – 7.2 GHz Power Amplifier MMIC
The length of RF wires should be as short as possible. Use at least two wires between RF pad and 50 ohm line and
separate the wires to minimize the mutual inductance.
CHIP OUTLINE
Chip Size 2650 x 2000 microns
Chip Thickness: 85 ± 15 microns
PAD Dimensions: 100 x 100 microns
All Dimensions in Microns
Specifications are subject to change without notice.
Excelics Semiconductor, Inc. 310 De Guigne Drive, Sunnyvale, CA 94085
Phone: 408-737-1711 Fax: 408-737-1868 Web: www.excelics.com
page 3 of 3
Revised February 2006
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