PI3B3251LE Просмотр технического описания (PDF) - Pericom Semiconductor Corporation
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PI3B3251LE Datasheet PDF : 5 Pages
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Packaging Mechanical: 16-pin TSSOP (L)
16
PI3B3251
3.3V, 8:1 Mux/DeMux NanoSwitch™
DOCUMENT CONTROL NO.
PD - 1310
REVISION: E
DATE: 03/09/05
.169 4.3
.177 4.5
1
.193
.201
4.9
5.1
.0256
.007
BSC
.012
0.65
0.19
0.30
.047
max.
1.20
SEATING
PLANE
.002 0.05
.006 0.15
Note:
1. Package Outline Exclusive of Mold Flash and Metal Burr
2. Controlling dimentions in millimeters
3. Ref: JEDEC MO-153F/AB
0.45 .018
0.75 .030
.252
BSC
6.4
.004 0.09
.008 0.20
Pericom Semiconductor Corporation
3545 N. 1st Street, San Jose, CA 95134
1-800-435-2335 • www.pericom.com
DESCRIPTION: 16-Pin, 173-Mil Wide, TSSOP
PACKAGE CODE: L
Ordering Information
Ordering Code
PI3B3251QE
PI3B3251LE
Package Code
Q
L
Package Description
Pb-free & Green, 16-pin QSOP
Pb-free & Green, 16-Pin TSSOP
Notes:
• Thermal characteristics can be found on the company web site at www.pericom.com/packaging/
• "E" denotes Pb-free and Green
• Adding an "X" at the end of the ordering code denotes tape and reel packaging
09-0037
Pericom Semiconductor Corporation • 1-800-435-2336 • www.pericom.com
5
PS8150G
03/02/09
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