MAS9275ATC1(2002) Просмотр технического описания (PDF) - Micro Analog Systems Oy

Номер в каталоге

Компоненты Описание

Список матч

MAS9275ATC1
(Rev.:2002)

IC FOR 10.00 – 30.00 MHz VCXO

Micro Analog Systems Oy 

PIN DESCRIPTION

DA9275.002

8 February, 2002

Pin Description

Symbol

x-coordinate

y-coordinate

Note

Crystal/Varactor Oscillator Input

X1

209

209

Voltage Control Input

VC

425

213

Power Supply Ground

VSS

600

226

Buffer Output

OUT

1029

1076

Power Supply Voltage

VDD

371

1065

Crystal Oscillator Output

X2

197

1080

Tri State

PD

830

1076

1)

Note1: Output buffer is off during voltage in PD pin stays between 1.6 V and VDD.

Note: Because the substrate of the die is internally connected to GND, the die has to be connected to GND or

left floating. Please make sure that GND is the first pad to be bonded. Pick-and-place and all component

assembly are recommended to be performed in ESD protected area.

Note: Pad coordinates are measured from the left bottom corner of the chip to the center of the pads. The

coordinates may vary depending on sawing width and location, however, distances between pads are accurate.

ABSOLUTE MAXIMUM RATINGS

Parameter

Supply Voltage

Input Pin Voltage

Power Dissipation

Storage Temperature

Symbol

VDD - VSS

PMAX

TST

Min

-0.3

VSS -0.3

-40

Max

6.0

VDD + 0.3

100

120

Unit

V

V

mW

oC

Note

RECOMMENDED OPERATION CONDITIONS

Parameter

Supply Voltage

Supply Current

Operating Temperature

Storage Temperature

Crystal Pulling Sensitivity

Crystal Load Capacitance

Symbol

VDD

Idd

TOP

TS

S

CL

Conditions

VDD = 2.8 Volt

Relative humidity =

15%…70%

Min Typ Max Unit

2.7 2.8 5.5

V

2.3

mA

-30

+85

oC

-5

+40

oC

30

ppm/pF

7

pF

2 (5)

Share Link: