CS8121 Просмотр технического описания (PDF) - ON Semiconductor

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CS8121

5V, 1A Linear Regulator with RESET and ENABLE

ON Semiconductor 

Application Notes: continued

VIN

C1*

0.1µF

C1*required if regulator is located far from

the power supply filter.

C2** required for stability.

VOUT

CS8121

ENABLE

RESET

RRST

to µP

RESET

Port

CRST

C2**

10µF

5V to µP and

System

Power

Figure 6: Test and application circuit showing output compensation.

Step 6: Test the load transient response by switching in

various loads at several frequencies to simulate its real

working environment. Vary the ESR to reduce ringing.

Step 7: Remove the unit from the environmental chamber

and heat the IC with a heat gun. Vary the load current as

instructed in step 5 to test for any oscillations.

Once the minimum capacitor value with the maximum

ESR is found, a safety factor should be added to allow for

the tolerance of the capacitor and any variations in regula-

tor performance. Most good quality aluminum electrolytic

capacitors have a tolerance of +/- 20% so the minimum

value found should be increased by at least 50% to allow

for this tolerance plus the variation which will occur at

low temperatures. The ESR of the capacitor should be less

than 50% of the maximum allowable ESR found in step 3

above.

Calculating Power Dissipation

in a Single Output Linear Regulator

The maximum power dissipation for a single output regu-

lator (Figure 7) is:

PD(max) = {VIN(max) - VOUT(min)}IOUT(max) + VIN(max)IQ

(1)

IIN

VIN

Smart

Regulator

}Control

Features

IQ

IOUT

VOUT

Figure 7: Single output regulator with key performance parameters

labeled.

where:

VIN(max) is the maximum input voltage,

VOUT(min) is the minimum output voltage,

IOUT(max) is the maximum output current for the applica-

tion, and

IQ is the quiescent current the regulator consumes at

IOUT(max).

Once the value of PD(max) is known, the maximum permis-

sible value of RΘJA can be calculated:

RΘJA =

150°C - TA

PD

(2)

The value of RΘJA can then be compared with those in

the package section of the data sheet. Those packages

with RΘJA's less than the calculated value in equation 2

will keep the die temperature below 150°C.

In some cases, none of the packages will be sufficient to

dissipate the heat generated by the IC, and an external

heatsink will be required.

Heat Sinks

A heat sink effectively increases the surface area of the

package to improve the flow of heat away from the IC

and into the surrounding air.

Each material in the heat flow path between the IC and

the outside environment will have a thermal resistance.

Like series electrical resistances, these resistances are

summed to determine the value of RΘJA:

RΘJA = RΘJC + RΘCS + RΘSA

(3)

where:

RΘJC = the junction–to–case thermal resistance,

RΘCS = the case–to–heatsink thermal resistance, and

RΘSA = the heatsink–to–ambient thermal resistance.

RΘJC appears in the package section of the data sheet. Like

RΘJA, it too is a function of package type. RΘCS and RΘSA

are functions of the package type, heatsink and the inter-

face between them. These values appear in heat sink data

sheets of heat sink manufacturers.

7

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