HCTS161AD Просмотр технического описания (PDF) - Intersil

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HCTS161AD

Radiation Hardened Synchronous Counter

Intersil 

Die Characteristics

DIE DIMENSIONS:

86 x 104mils

2.19 x 2.65mm

METALLIZATION:

Type: AlSi

Metal Thickness: 11kÅ ± 1kÅ

GLASSIVATION:

Type: SiO2

Thickness: 13kÅ ± 2.6kÅ

WORST CASE CURRENT DENSITY:

<2.0 x 105A/cm2

BOND PAD SIZE:

100µm x 100µm

4 x 4 mils

Metallization Mask Layout

HCTS161AMS

HCTS161AMS

CP

MR

(2)

(1)

VCC

(16)

P0 (3)

P1 (4)

P2 (5)

P3 (6)

(15) TC

(14) Q0

(13) Q1

(12) Q2

PE (7)

(11) Q3

(8)

(9)

(10)

GND

SPE

TE

NOTE: The die diagram is a generic plot form a similar HCS device. It is intended to indicate approximate die size and bond pad location.

The mask series for the HCTS161A is TA14446A.

Spec Number 518888

9

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