CXD3526GG Просмотр технического описания (PDF) - Sony Semiconductor
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CXD3526GG Datasheet PDF : 88 Pages
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CXD3526GG
Power Consumption and Allowable Power Dissipation
The relationship between the power consumption and junction temperature of this IC must satisfy the following
formula.
Tj [°C] ≥ Toprmax [°C] + θja [°C/W] × PD [W]
In addition, specification values are as follows.
Tjmax = 125 [°C]
Toprmax = 75 [°C]
θja = 43 [°C/W] (When mounted on 4-layer substrate, wind speed 0m/s)
Under these conditions, PDmax, the maximum allowable power dissipation for the package, is as follows.
PDmax = (125 – 75)/43 = 1162 [mW]
Furthermore, if the operating frequency of this IC exceeds 85MHz, the junction temperature may exceed its
maximum value depending on conditions of use. Use this IC under conditions where the maximum value for
the junction temperature will not be exceeded by lowering the thermal resistance of the package as follows by
taking thermal countermeasures at this time.
Wind speed 1m/s: θja = 40 [°C/W] (When mounted on 4-layer substrate)
Wind speed 3m/s: θja = 35 [°C/W] (When mounted on 4-layer substrate)
1400
1300
1200
1100
1000
900
800
700
50
60
70
80
90
100
Operating frequency [MHz]
Operating Frequency vs. Power Consumption (Maximum Values)
130
120
110
100
90
80
70
500
43˚C/W 40˚C/W
35˚C/W
700
900
1100
1300
Power consumption [mW]
1500
Power Consumption vs. Junction Temperature (for Various Values of Thermal Resistance)
–9–
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