BUK7507-30B Просмотр технического описания (PDF) - Philips Electronics

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BUK7507-30B

TrenchMOS™ standard level FET

Philips Electronics 

Philips Semiconductors

7. Soldering

handbook, full pagewidth

1.50

2.25 2.15

8.15 8.35

1.50

4.60

0.30

4.85

7.95

3.00

solder lands

solder resist

occupied area

solder paste

Dimensions in mm.

Fig 18. Reflow soldering footprint for SOT404.

BUK75/7607-30B

TrenchMOS™ standard level FET

10.85

10.60

10.50

7.50

7.40

1.70

8.275

5.40

8.075

0.20

5.08

1.20

1.30

1.55

MSD057

9397 750 11232

Product data

Rev. 01 — 07 April 2003

© Koninklijke Philips Electronics N.V. 2003. All rights reserved.

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