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UAA2073AM Просмотр технического описания (PDF) - Philips Electronics

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UAA2073AM Datasheet PDF : 20 Pages
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Philips Semiconductors
Image rejecting front-end
for GSM applications
Product specification
UAA2073AM
Table 1 Control of power status
EXTERNAL PIN LEVEL
TXON
LOW
LOW
HIGH
LOW
LOW
HIGH
HIGH
HIGH
RXON
LOW
HIGH
LOW
LOW
HIGH
LOW
HIGH
HIGH
SXON
LOW
LOW
LOW
HIGH
HIGH
HIGH
LOW
HIGH
CIRCUIT MODE OF OPERATION
power-down mode
RX mode: receive section and LO buffers to RX on
TX mode: transmit section and LO buffers to TX on
SX mode: complete LO section on
SRX mode: receive section on and SX mode active
STX mode: transmit section on and SX mode active
receive and transmit sections on; specification not guaranteed
receive and transmit sections on; specification not guaranteed
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).
SYMBOL
VCC
GND
Pi(max)
Tj(max)
Pdis(max)
Tstg
PARAMETER
MIN.
supply voltage
difference in ground supply voltage applied between GND1 and GND2
maximum power input
maximum operating junction temperature
maximum power dissipation in stagnant air
IC storage temperature
65
MAX.
9
0.6
+20
+150
250
+150
UNIT
V
V
dBm
°C
mW
°C
HANDLING
Every pin withstands the ESD test in accordance with MIL-STD-883C class 2 (method 3015.5).
THERMAL CHARACTERISTICS
SYMBOL
PARAMETER
Rth j-a
thermal resistance from junction to ambient in free air
VALUE
120
UNIT
K/W
1997 Jan 27
7

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