Features
• Low Turn-on Voltage
• Fast Switching
• PN Junction Guard Ring for Transient and ESD Protection
• Lead Free/RoHS Compliant (Note 3)
• “Green” Molding Compound (No Br, Sb) (Note 4)
• Qualified to AEC-Q101 Standards for High Reliability
BAT54 /A /C /S
SURFACE MOUNT SCHOTTKY BARRIER DIODE
Mechanical Data
• Case: SOT-23
• Case Material: Molded Plastic, “Green” Molding Compound.
UL Flammability Classification Rating 94V-0
• Moisture Sensitivity: Level 1 per J-STD-020
• Terminals: Matte Tin Finish annealed over Alloy 42 leadframe
(Lead Free Plating). Solderable per MIL-STD-202, Method 208
• Polarity: See Diagrams Below
• Marking Information: See Page 3
• Ordering Information: See Page 2
• Weight: 0.008 grams (approximate)
Top View
BAT54
BAT54A
BAT54C
BAT54S
Maximum Ratings @TA = 25°C unless otherwise specified
Characteristic
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
Forward Continuous Current (Note 2)
Repetitive Peak Forward Current
Forward Surge Current
@ t < 1.0s
Symbol
VRRM
VRWM
VR
IF
IFRM
IFSM
Value
30
200
300
600
Unit
V
mA
mA
mA
Thermal Characteristics
Characteristic
Power Dissipation (Note 2)
Thermal Resistance, Junction to Ambient Air (Note 2)
Operating and Storage Temperature Range (Note 5)
Symbol
PD
RθJA
TJ, TSTG
Value
200
500
-65 to +150
Unit
mW
°C/W
°C
Electrical Characteristics @TA = 25°C unless otherwise specified
Characteristic
Reverse Breakdown Voltage (Note 1)
Forward Voltage
Reverse Leakage Current (Note 1)
Total Capacitance
Reverse Recovery Time
Symbol Min
Typ
Max Unit
Test Condition
V(BR)R
30
⎯
⎯
V IRS = 100μA
240
IF = 0.1mA
320
IF = 1mA
VF
⎯
⎯
400
mV IF = 10mA
500
IF = 30mA
800
IF = 100mA
IR
⎯
⎯
2.0
μA VR = 25V
CT
⎯
⎯
10
pF VR = 1.0V, f = 1.0MHz
trr
⎯
⎯
5.0
ns
IF = 10mA through IR = 10mA to
IR = 1.0mA, RL = 100Ω
Notes:
1. Short duration test pulse used to minimize self-heating effect.
2. Part mounted on FR-4 board with recommended pad layout, which can be found on our website at http://www.diodes.com/datasheets/ap02001.pdf.
3. No purposefully added lead.
4. Products manufactured with date code VD (Week 50, 2008) and newer are built with Green Molding Compound. Products manufactured with date code
prior to VD are built with Non-Green Molding Compound and may contain Halogens or Sb2O3 Fire Retardants.
5. The heat generated must be less than the thermal conductivity from Junction-to-Ambient: dPD/dTJ < 1/RθJA
BAT54 /A /C /S
Document number: DS11005 Rev. 25 - 2
1 of 4
www.diodes.com
June 2010
© Diodes Incorporated