ML9473TB Просмотр технического описания (PDF) - LAPIS Semiconductor Co., Ltd.

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Компоненты Описание

Список матч

ML9473TB

1/3, 1/4, 1/5 Duty 60 Output LCD Driver

LAPIS Semiconductor Co., Ltd. 

LAPIS Semiconductor

PACKAGE DIMENSIONS

TQFP80-P-1212-0.50-K

FEDL9473-01

ML9473

(Unit: mm)

5

Package material

Lead frame material

Lead finish

Pin treatment

Package weight (g)

Rev. No./Last Revised

Epoxy resin

42 alloy

Sn-2Bi (Bi 2% typ.)

Plating (≥5µm)

0.40 TYP.

1/Feb. 1, 2008

Notes for Mounting the Surface Mount Type Package

The surface mount type packages are very susceptible to heat in reflow mounting and humidity absorbed in

storage. Therefore, before you perform reflow mounting, contact ROHM's responsible sales person for the

product name, package name, pin number, package code and desired mounting conditions (reflow method,

temperature and times).

18/20

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