BYG23MM2 Просмотр технического описания (PDF) - TSC Corporation

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BYG23MM2

High Efficient Surface Mount Rectifiers

TSC Corporation 

FIG. 5 TYPICAL INSTANTANEOUS

FORWARD CHARACTERISTICS

10

BYG23M

Taiwan Semiconductor

1

0.1

0.4 0.6 0.8 1 1.2 1.4 1.6 1.8 2 2.2 2.4 2.6 2.8 3

FORWARD VOLTAGE (V)

PACKAGE OUTLINE DIMENSIONS

DO-214AC (SMA)

DIM.

A

B

C

D

E

F

G

H

Unit (mm)

Min

Max

1.27 1.58

4.06 4.60

2.29 2.83

1.99 2.50

0.90 1.41

4.95 5.33

0.10 0.20

0.15 0.31

Unit (inch)

Min

Max

0.050 0.062

0.160 0.181

0.090 0.111

0.078 0.098

0.035 0.056

0.195 0.210

0.004 0.008

0.006 0.012

SUGGESTED PAD LAYOUT

Symbol

A

B

C

D

E

MARKING DIAGRAM

P/N =

G=

YW =

F=

Specific Device Code

Green Compound

Date Code

Factory Code

Document Number: DS_D1411087

Unit (mm)

1.68

1.52

3.93

2.41

5.45

Unit (inch)

0.066

0.060

0.155

0.095

0.215

Version: B14

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