CXD2073S Просмотр технического описания (PDF) - Sony Semiconductor

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CXD2073S

Digital Comb Filter (NTSC)

Sony Semiconductor 

Package Outline

Unit: mm

30PIN SDIP (PLASTIC)

+ 0.4

26.9 – 0.1

30

16

1

15

1.778

CXD2073S

0° to 15°

0.5 ± 0.1

0.9 ± 0.15

SONY CODE

EIAJ CODE

JEDEC CODE

SDIP-30P-01

SDIP030-P-0400

Two kinds of package surface:

1.All mat surface type.

2.All mirror surface type.

PACKAGE STRUCTURE

MOLDING COMPOUND EPOXY RESIN

LEAD TREATMENT

SOLDER/PALLADIUM

PLATING

LEAD MATERIAL

COPPER ALLOY

PACKAGE MASS

1.8g

– 11 –

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