CX3225GB10000P0HPQCC Просмотр технического описания (PDF) - Unspecified

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CX3225GB10000P0HPQCC

Quartz Crystal

Unspecified 

Drawing No.

K1101-13754-432 10/11

8.6 Resistance to Moisture

8.7 Soldering condition

Test condition

The quartz crystal unit shall be stored at a

temperature of 60±2°C wich relative humidity of

90% to 95% for 240 h. Then it shall be subjected

to standard atmospheric conditions for 1h，after

which measurements shall be made

1.） Material of solder

Kind … lead free solder paste

Melting point … +220±5°C

2.） Reflow temp.profile

Temp [°C]

Preheating

+150 to +180

Peak

+260±5

Total

―

Frequency shift : ±2ppm

3.） Hand Soldering +350°C 3 sec MAX

4.） Reflow Times 2 times

Time[sec]

150 (typ.)

10 (max.)

300 (max.)

Reflow temp.profile

8.8 Intensity for bending in circuit board

Solder this product in center of the circuit board of 40mm×100mm，

and add the deflection of 3mm as the bottom figure.

Test board : t＝1.6mm

PUSH

20

board

10

R5

Product

45

45

R340

press jig

UNIT : mm

KYOCERA Crystal Device Corporation

KBS-5079E

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