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STM1061 Просмотр технического описания (PDF) - STMicroelectronics

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STM1061
ST-Microelectronics
STMicroelectronics ST-Microelectronics
STM1061 Datasheet PDF : 21 Pages
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STM1061
PACKAGE MECHANICAL
In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These
packages have a Lead-free second level interconnect. The category of second Level Interconnect is
marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97.
The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK
is an ST trademark. ECOPACK specifications are available at: www.st.com.
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