HCC4030BDT Просмотр технического описания (PDF) - STMicroelectronics
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HCC4030BDT Datasheet PDF : 34 Pages
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HCC40xxx, HCC45xxx
Package information
5.2
Ceramic DIL-14 package information
Figure 4. Ceramic DIL-14 package outline
*$06&%
1. The upper metallic lid is not electrically connected to any pins, nor to the IC die inside the package.
Connecting unused pins or metal lid to ground or to the power supply does not affect the electrical
characteristics.
Table 8. Ceramic DIL-14 mechanical data
Dimensions
Ref
Millimeters
Inches(1)
Min
Typ
Max
A
2.1
2.54
a1
3.00
a2
0.63
B
1.82
b
0.40
b1
0.20
D
18.79
E
7.36
e
e1
15.11
0.88
2.03
0.45
0.254
19.00
7.62
2.54
15.24
3.70
1.14
2.39
0.50
0.30
19.20
7.87
15.37
e2
7.62
7.87
8.12
F
7.11
7.75
I
3.70
K
10.90
12.1 n
L
1.14
1.27
1.5
1. Values in inches are rounded to three decimal digits.
Min
0.083
0.118
0.025
0.072
0.016
0.008
0.740
0.290
0.595
0.300
0.280
0.429
Typ
0.035
0.080
0.018
0.010
0.748
0.300
0.100
0.600
0.310
0.050
Max
0.100
0.146
0.045
0.094
0.020
0.012
0.756
0.310
0.605
0.320
0.305
0.146
0.476 n
0.059
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