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L6204(1994) Просмотр технического описания (PDF) - STMicroelectronics

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L6204
(Rev.:1994)
ST-Microelectronics
STMicroelectronics ST-Microelectronics
L6204 Datasheet PDF : 10 Pages
1 2 3 4 5 6 7 8 9 10
L6204
a voltage higher than VS is supplied on pin 20
(Vboot). This bootstrap voltage is not needed for
the lower power DMOS transistor because their
sources are grounded. To produce this voltage a
charge pump method is used and mAde by two
external capacitors and two diodes. It can supply
the 4 driving blocks of the high side drivers. Using
an external capacitor the turn-on speed of the
high side driver is very high; furthermore with dif-
ferent capacitance values it is possible to adapt
the device to different switching frequencies. It is
also possible to operate two or more L6204s us-
ing only 2 diodes and 2 capacitance for all the
ICs; all the Vboot pins are connected to the Cstore
capacitance while the pin 11 (VCP) of just one
L6204 is connect to Cpump, obviously all the
L6204 ICs have to be connected to the same VS.
(see fig. 4)
Figure 4
the voltage created across the sense resistor is
usually much less than the peak value, although a
small RC filter can be added if necessary.
POWER DISSIPATION (each bridge)
In order to achieve the high performance provided
by the L6204 some attention must be paid to en-
sure that it has an adequate PCB area to dissi-
pate the heat. The first stage of any thermal de-
sign is to calculate the dissipated power in the
application, for this example the half step opera-
tion shown in figure 5 is considered.
RISE TIME Tr
When an arm of the half bridge is turned on cur-
rent begins to flow in the inductive load until the
maximum current IL is reached after a time Tr.
The dissipated energy EOFF/ON is in this case :
EOFF/ON = [RDS(ON) IL2 Tr] 2/3
Figure 5
DEAD TIME
To protect the device against simultaneous con-
duction in both arms of the bridge and the result-
ing rail-to-rail short, the logic circuits provide a
dead time.
THERMAL PROTECTION
A thermal protection circuit has been included
that will disable the device if the junction tempera-
ture reaches 150 °C. When the temperature has
fallen to a safe level the device restarts under the
control of the input and enable signals.
APPLICATION INFORMATION
RECIRCULATION
During recirculation with the ENABLE input high,
the voltage drop across the transistor is RDS(ON).
IL for voltages less than 0.7 V and is clamped at a
voltage depending on the characteristics of the
source-drain diode for greater voltages. Although
the device is protected against cross conduction,
current spikes can appear on the current sense
pin due to charge/discharge phenomena in the in-
trinsic source drain capacitances. In the applica-
tion this does not cause any problems because
6/10
ON TIME TON
During this time the energy dissipated is due to
the ON resistance of the transistors EON and the
commutation ECOM. As two of the POWER DMOS
transistors are ON EON is given by :
EON = IL2 RDS(ON) 2 TON
In the commutation the energy dissipated is :
ECOM = VS IL TCOM fSWITCH TON
Where :
TCOM = Commutation Time and it is assumed that ;
TCOM = TTURN-ON = TTURN-OFF = 100 ns
fSWITCH = Chopper frequency
FALL TIME Tf
For this example it is assumed that the energy
dissipated in this part of the cycle takes the same
form as that shown for the rise time :
EON/OFF = [RDS(ON) IL2Tf] 2/3

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