WS128K32-XG2UX Просмотр технического описания (PDF) - Microsemi Corporation

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WS128K32-XG2UX

128Kx32 SRAM MODULE, SMD 5962-93187

Microsemi Corporation 

WS128K32-XXX

PACKAGE 400 – 66 PIN, PGA TYPE, CERAMIC HEX-IN-LINE PACKAGE, HIP (H1)

ALL LINEAR DIMENSIONS ARE MILLIMETERS AND PARENTHETICALLY IN INCHES

PACKAGE 502 – 68 LEAD, CERAMIC QUAD FLAT PACK, LOW PROFILE CQFP (G4T)1

ALL LINEAR DIMENSIONS ARE MILLIMETERS AND PARENTHETICALLY IN INCHES

Microsemi Corporation reserves the right to change products or specifications without notice.

May 2011 © 2011 Microsemi Corporation. All rights reserved.

6

Rev. 5

Microsemi Corporation • (602) 437-1520 • www.whiteedc.com

www.microsemi.com

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