H11AG3300 Просмотр технического описания (PDF) - Fairchild Semiconductor
Номер в каталоге
Компоненты Описание
производитель
H11AG3300 Datasheet PDF : 8 Pages
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PHOTOTRANSISTOR OPTOCOUPLERS
H11AG1
H11AG2
H11AG3
Package Dimensions (Through Hole)
PIN 1
ID.
0.270 (6.86)
0.240 (6.10)
0.070 (1.78)
0.045 (1.14)
0.350 (8.89)
0.330 (8.38)
0.200 (5.08)
0.135 (3.43)
0.154 (3.90)
0.100 (2.54)
0.022 (0.56)
0.016 (0.41)
0.100 (2.54)
TYP
0.020 (0.51)
MIN
0.016 (0.40)
0.008 (0.20)
0° to 15°
0.300 (7.62)
TYP
Package Dimensions (Surface Mount)
0.350 (8.89)
0.330 (8.38)
3
2
1
PIN 1
ID.
0.270 (6.86)
0.240 (6.10)
4
5
6
0.070 (1.78)
0.045 (1.14)
0.200 (5.08)
0.165 (4.18)
0.022 (0.56)
0.016 (0.41)
0.020 (0.51)
MIN
0.100 (2.54)
TYP
Lead Coplanarity : 0.004 (0.10) MAX
0.300 (7.62)
TYP
0.016 (0.40) MIN
0.315 (8.00)
MIN
0.405 (10.30)
MAX
0.016 (0.41)
0.008 (0.20)
Package Dimensions (0.4”Lead Spacing)
Recommended Pad Layout for
Surface Mount Leadform
0.270 (6.86)
0.240 (6.10)
0.350 (8.89)
0.330 (8.38)
0.070 (1.78)
0.045 (1.14)
0.200 (5.08)
0.135 (3.43)
0.154 (3.90)
0.100 (2.54)
0.022 (0.56)
0.016 (0.41)
0.004 (0.10)
MIN
0.100 (2.54) TYP
0.016 (0.40)
0.008 (0.20)
0° to 15°
0.400 (10.16)
TYP
NOTE
All dimensions are in inches (millimeters)
0.070 (1.78)
0.060 (1.52)
0.415 (10.54)
0.100 (2.54)
0.295 (7.49)
0.030 (0.76)
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