W25Q16DV Просмотр технического описания (PDF) - Winbond
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W25Q16DV Datasheet PDF : 80 Pages
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9.5 8-Pad USON 4x3-mm (Package Code UU)
Symbol
A
A1
A3
b
D
D1
D2
E
E1
e
L
Min
0.50
0.00
---
0.25
3.90
0.70
0.70
2.90
0.10
0.55
Millimeters
Nom
0.55
0.02
0.15
0.30
4.00
0.80
0.80
3.00
0.20
0.80 BSC
0.60
Max
0.60
0.05
---
0.35
4.10
0.90
0.90
3.10
0.30
0.65
Min
0.020
0.000
---
0.010
0.153
0.027
0.027
0.114
0.004
0.022
Inches
Nom
0.022
0.001
0.006
0.012
0.157
0.031
0.031
0.118
0.008
0.031 BSC
0.024
Max
0.024
0.002
---
0.014
0.161
0.035
0.035
0.122
0.012
0.026
Note:The metal pad area on the bottom center of the package is not connected to any internal electrical signals. It
can be left floating or connected to the device ground (GND pin). Avoid placement of exposed PCB vias under the
pad.
- 73 -
Publication Release Date: January 26, 2015
Revision J
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