25Q32BVAIG Просмотр технического описания (PDF) - Winbond

Номер в каталоге

Компоненты Описание

Список матч

25Q32BVAIG

3V 32M-BIT SERIAL FLASH MEMORY WITH DUAL AND QUAD SPI

Winbond 

W25Q32BV

7.2.37

7.2.38

7.2.39

Erase Security Registers (44h)...........................................................................................58

Program Security Registers (42h) ......................................................................................59

Read Security Registers (48h) ...........................................................................................60

8. ELECTRICAL CHARACTERISTICS .............................................................................................. 61

8.1 Absolute Maximum Ratings (1)(2) ................................................................................... 61

8.2 Operating Ranges .............................................................................................................. 61

8.3 Power-Up Power-Down Timing and Requirements(1 ........................................................ 62

8.4 DC Electrical Characteristics.............................................................................................. 63

8.5 AC Measurement Conditions ............................................................................................. 64

8.6 AC Electrical Characteristics .............................................................................................. 65

8.7 AC Electrical Characteristics (cont’d) ................................................................................. 66

8.8 Serial Output Timing........................................................................................................... 67

8.9 Serial Input Timing.............................................................................................................. 67

8.10 HOLD Timing...................................................................................................................... 67

8.11 WP Timing .......................................................................................................................... 67

9. PACKAGE SPECIFICATION .......................................................................................................... 68

9.1 8-Pin SOIC 208-mil (Package Code SS) ........................................................................... 68

9.2 8-Pin VSOP 208-mil (Package Code ST) .......................................................................... 69

9.3 8-Pin PDIP 300-mil (Package Code DA)............................................................................ 70

9.4 8-Pad WSON 6x5-mm (Package Code ZP)....................................................................... 71

9.5 8-Pad WSON 8x6-mm (Package Code ZE)....................................................................... 72

9.6 16-Pin SOIC 300-mil (Package Code SF).......................................................................... 73

9.7 24-Ball TFBGA 8x6-mm (Package Code TB, 5x5-1 ball array) ......................................... 74

9.8 24-Ball TFBGA 8x6-mm (Package Code TC, 6x4 ball array) ............................................ 75

10. ORDERING INFORMATION .......................................................................................................... 76

10.1 Valid Part Numbers and Top Side Marking ........................................................................ 77

11. REVISION HISTORY...................................................................................................................... 78

-4-

Share Link: