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TDA7499SA_03

6W+6W STEREO AMPLIFIER WITH MUTE & ST-BY

STMicroelectronics 

TDA7499SA

HEAT SINK DIMENSIONING:

In order to avoid the thermal protection intervention, that is placed approximatively at Tj = 150°C, it is important

the dimensioning of the Heat Sinker RTh (°C/W).

The parameters that influence the dimensioning are:

– Maximum dissipated power for the device (Pdmax)

– Max thermal resistance Junction to case (RTh j-c)

– Max. ambient temperature Tamb max

– Quiescent current Iq (mA)

Example:

VCC = ±10V, Rload = 8ohm, RTh j-c = 3.9 °C/W , Tamb max = 50°C

Pdmax = (N° channels) ·

------2----V----c---c--2-------

Π2 ⋅ Rload

+

Iq

⋅

Vcc

Pdmax = 2 · ( 2.5 ) + 0.8 = 6W

(Heat Sinker)

RTh c-a

=

1----5---0-----–-----T---a---m-----b----m----a---x-

Pd max

–

RTh

j-c

=

1----5---0-----–----5----0-- – 3.9

6

=

12.7 ° C /W

In figure 7 is shown the Power derating curve for the device.

Figure 7. Power derating curve

25

20

15

10

5

0

0

(a)

(b)

(c)

40

80

120

Tamb (°C)

a) Infinite Heatsink

b) 10 °C/ W

c) 15 °C/ W

160

7/10

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