A1171 Просмотр технического описания (PDF) - Allegro MicroSystems
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A1171 Datasheet PDF : 10 Pages
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A1171
Micropower Ultrasensitive Hall Effect Switch
Package EW, 6-pin DFN/MLP
1.50 ±0.15
6
0.75 F
0.50
E
6
0.30
1.00 F
2.00 ±0.15
A
F
0.70 1.575
1
7X D
0.08 C
0.50 BSC
1
C
SEATING
PLANE
0.38 ±0.02
0.25 ±0.05
0.325
1
1.10
C PCB Layout Reference View
0.70 ±0.10 1.25 ±0.05
B
0.325
+0.055
–0.045
6
1.10 ±0.10
1
G Standard Branding Reference View
N = Last two digits of device part number
Y = Last digit of year of manufacture
W = Week of manufacture
For Reference Only, not for tooling use (refernce DWG-2856; similar to
JEDEC Type 1, MO-229X2BCD)
Dimensions in millimeters
Exact case and lead configuration at supplier discretion within limits shown
A Terminal #1 mark area
B Exposed thermal pad (reference only, terminal #1
identifier appearance at supplier discretion)
C Reference land pattern layout (reference IPC7351
SON50P200X200X100-9M);
All pads a minimum of 0.20 mm from all adjacent pads; adjust as
necessary to meet application process requirements and PCB layout
tolerances; when mounting on a multilayer PCB, thermal vias at the
exposed thermal pad land can improve thermal dissipation (reference
EIA/JEDEC Standard JESD51-5)
D Coplanarity includes exposed thermal pad and terminals
E Active Area Depth 0.15 mm REF
F Hall Element (not to scale)
G Branding scale and appearance at supplier discretion
Allegro MicroSystems, LLC
9
115 Northeast Cutoff
Worcester, Massachusetts 01615-0036 U.S.A.
1.508.853.5000; www.allegromicro.com
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