H11L1-M Просмотр технического описания (PDF) - Fairchild Semiconductor

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H11L1-M

6-PIN DIP OPTOISOLATORS LOGIC OUTPUT

Fairchild Semiconductor 

6-PIN DIP

OPTOISOLATORS LOGIC OUTPUT

H11L1M

H11L2M

H11L3M

Package Dimensions (Through Hole)

0.350 (8.89)

0.320 (8.13)

Package Dimensions (Surface Mount)

0.350 (8.89)

0.320 (8.13)

0.260 (6.60)

0.240 (6.10)

0.260 (6.60)

0.240 (6.10)

0.390 (9.90)

0.332 (8.43)

0.070 (1.77)

0.040 (1.02)

0.200 (5.08)

0.115 (2.93)

0.014 (0.36)

0.010 (0.25)

0.320 (8.13)

0.100 (2.54)

0.015 (0.38)

0.020 (0.50)

0.016 (0.41)

0.100 (2.54)

15°

0.012 (0.30)

Package Dimensions (0.4”Lead Spacing)

0.350 (8.89)

0.320 (8.13)

0.070 (1.77)

0.040 (1.02)

0.200 (5.08)

0.115 (2.93)

0.025 (0.63)

0.020 (0.51)

0.020 (0.50)

0.016 (0.41)

0.014 (0.36)

0.010 (0.25)

0.320 (8.13)

0.012 (0.30)

0.008 (0.20)

0.100 [2.54]

0.035 (0.88)

0.006 (0.16)

Recommended Pad Layout for

Surface Mount Leadform

0.260 (6.60)

0.240 (6.10)

0.070 (1.77)

0.040 (1.02)

0.014 (0.36)

0.010 (0.25)

0.200 (5.08)

0.115 (2.93)

0.100 (2.54)

0.015 (0.38)

0.020 (0.50)

0.016 (0.41)

0.100 [2.54]

0.012 (0.30)

0.008 (0.21)

0.425 (10.80)

0.400 (10.16)

NOTE

All dimensions are in inches (millimeters)

0.070 (1.78)

0.060 (1.52)

0.425 (10.79)

0.100 (2.54)

0.305 (7.75)

0.030 (0.76)

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11/01/01 DS300222

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