XC61CC1302 Просмотр технического описания (PDF) - TOREX SEMICONDUCTOR

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XC61CC1302

Voltage detectors

TOREX SEMICONDUCTOR 

XC61C

Series

■NOTES ON USE

1. Please use this IC within the stated maximum ratings. Operation beyond these limits may cause degrading or permanent

damage to the device.

2. When a resistor is connected between the VIN pin and the input with CMOS output configurations, oscillation may occur

as a result of voltage drops at RIN if load current (IOUT) exists. (refer to the Oscillation Description (1) below)

3. When a resistor is connected between the VIN pin and the input with CMOS output configurations, irrespective of N-ch

output configurations, oscillation may occur as a result of through current at the time of voltage release even if load

current (IOUT) does not exist. (refer to the Oscillation Description (2) below )

4. With a resistor connected between the VIN pin and the input, detect and release voltage will rise as a result of the IC's

supply current flowing through the VIN pin.

5. In order to stabilize the IC's operations, please ensure that VIN pin's input frequency's rise and fall times are more than

several µ sec / V.

6. Please use N-ch open drains configuration, when a resistor RIN is connected between the VIN pin and power source.

In such cases, please ensure that RIN is less than 10kΩ and that C is more than 0.1µF.

●Oscillation Description

(1) Output current oscillation with the CMOS output configuration

When the voltage applied at IN rises, release operations commence and the detector's output voltage increases. Load

current (IOUT) will flow at RL. Because a voltage drop (RIN x IOUT) is produced at the RIN resistor, located between the input

(IN) and the VIN pin, the load current will flow via the IC's VIN pin. The voltage drop will also lead to a fall in the voltage level

at the VIN pin. When the VIN pin voltage level falls below the detect voltage level, detect operations will commence.

Following detect operations, load current flow will cease and since voltage drop at RIN will disappear, the voltage level at

the VIN pin will rise and release operations will begin over again.

Oscillation may occur with this " release - detect - release " repetition.

Further, this condition will also appear via means of a similar mechanism during detect operations.

(2) Oscillation as a result of through current

Since the XC61C series are CMOS IC S, through current will flow when the IC's internal circuit switching operates (during

release and detect operations). Consequently, oscillation is liable to occur as a result of drops in voltage at the through

current's resistor (RIN) during release voltage operations. (refer to Figure 3)

Since hysteresis exists during detect operations, oscillation is unlikely to occur.

11/19

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