LLL216R71H103MD01L Просмотр технического описания (PDF) - Unspecified

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LLL216R71H103MD01L

Chip Multilayer Ceramic Capacitors for General

Unspecified 

!Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.

• This catalog has only typical specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

Notice

Continued from the preceding page.

Table 5 LLM Series Reflow Soldering Method

Series

Chip Dimension Code Chip

(L/W)

(LgW)

LLM

21

2.0g1.25

a

b, b'

c, c'

0.6 to 0.8 (0.3 to 0.5)

0.3

b=(c-e)/2, b'=(d-f)/2

d

e

f

2.0 to 2.6 1.3 to 1.8 1.4 to 1.6

C02E.pdf

Nov.27,2017

p

0.5

(in mm)

[Land for LLA Series]

Land

Chip Capacitor

[Land for LLM Series]

c

p

Chip Capacitor

Land

b'

c

p

Solder Resist

f

Solder Resist

d

<Applicable to beyond Rated Voltage of 200VDC>

2-2. Dimensions of Slit (Example)

Preparing the slit helps flux cleaning and resin

coating on the back of the capacitor.

However, the length of the slit design should be as

short as possible to prevent mechanical damage in

the capacitor.

A longer slit design might receive more severe

mechanical stress from the PCB.

Recommended slit design is shown in the Table.

Chip Capacitor

LgW

1.6g0.8

2.0g1.25

3.2g1.6

3.2g2.5

4.5g2.0

4.5g3.2

5.7g2.8

5.7g5.0

Slit

Solder Resist

L

d

Land

d

–

–

1.0 to 2.0

1.0 to 2.0

1.0 to 2.8

1.0 to 2.8

1.0 to 4.0

1.0 to 4.0

e

–

–

3.2 to 3.7

4.1 to 4.6

3.6 to 4.1

4.8 to 5.3

4.4 to 4.9

6.6 to 7.1

(in mm)

Continued on the following page.

286

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