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17448

BGA & CSP Rework System

Unspecified 

Specifications for the BGA/CSP-3500 Series Rework Systems

Rework System Model

BGA-3591/

CSP-3501

BGA-3592/

CSP-3502

BGA-3591J/

CSP-3501J

Base Unit Input Voltage

115VAC, 50/60Hz 230VAC, 50/60Hz 100VAC, 50/60Hz

Base Unit Power Consumption

1400W (BGA 3591) 940W (CSP 3501) 1010W (BGA/CSP 3500J)

Control Unit Input Voltage

115VAC, 50/60Hz 230VAC, 50/60Hz 100VAC, 50/60Hz

Control Unit Power Consumption

420W max

Base Unit Max Source Temperature

Bottom-side heater:

392°F (200°C)

Control Unit Max Source Temperature

from BGA-3582 Micro Oven

752°F (400°C)

Temperature Control/Range

Closed-loop K-type thermocouple feedback

Maximum PCB Dimensions

20.25” (489mm) x open frame

PCB Thickness

0.031” - 0.125” (0.8mm - 3.2mm)

Component Maximum Weight

.92 oz. (0.055 kg)

Component Types

BGA, QFP, PLCC, TSOP, SOIC, CSP

Airflow

3-20 l/min

Top Heater Element

28VAC, 280W max.

Vacuum Pump

12 VDC, 15” Hg (381mm Hg)

Base Unit Dimensions

22” x 24” x 19” (560 x 610 x 485 mm)

Base Unit Weight

76.5 lbs (34.7 kg)

BGA-3582 Micro Oven™

Head Assy Dimensions

10.5” x 5.0” x 3.25” (267 x 127 x 82.5mm)

BGA-3582 Micro Oven™

Head Assy Weight

2 lb. 10 oz (1.19 kg)

Control Unit Dimensions

13” x 6” x 9.5” (330 x 153 x 241mm)

Control Unit Weight

20 lb. 7 oz. (9.27 kg)

Warranty

One year

2

BGA-3500 Series Manual 5/01

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