74ALVT16827(2018) Просмотр технического описания (PDF) - NXP Semiconductors.

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74ALVT16827
(Rev.:2018)

20-bit buffer/line driver; non-inverting; 3-state

NXP Semiconductors. 

Nexperia

74ALVT16827

20-bit buffer/line driver; non-inverting; 3-state

11 Package outline

TSSOP56: plastic thin shrink small outline package; 56 leads; body width 6.1 mm

SOT364-1

D

y

Z

56

E

A

X

c

HE

vM A

29

pin 1 index

1

e

A2

A1

28

wM

bp

Q

(A 3 )

A

θ

Lp

L

detail X

0

2.5

5 mm

scale

DIMENSIONS (mm are the original dimensions).

UNIT

A

max.

A1

A2

A3

bp

c

D(1) E(2)

e

HE

L

Lp

Q

v

w

y

Z

θ

mm

1.2

0.15

0.05

1.05

0.85

0.25

0.28

0.17

0.2

0.1

14.1

13.9

6.2

6.0

0.5

8.3

7.9

1

0.8

0.4

0.50

0.35

0.25

0.08

0.1

0.5

0.1

8o

0o

Notes

1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.

2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.

OUTLINE

VERSION

IEC

SOT364-1

REFERENCES

JEDEC

JEITA

MO-153

EUROPEAN

PROJECTION

ISSUE DATE

99-12-27

03-02-19

Figure 8. Package outline SOT364-1 (TSSOP56)

74ALVT16827

Product data sheet

All information provided in this document is subject to legal disclaimers.

Rev. 4 — 24 January 2018

© Nexperia B.V. 2018. All rights reserved.

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