NCP6335XFCCT1G Просмотр технического описания (PDF) - ON Semiconductor
Номер в каталоге
Компоненты Описание
Список матч
NCP6335XFCCT1G Datasheet PDF : 35 Pages
| |||
NCP6335xFCCT1G
MAXIMUM RATINGS
Rating
Symbol
Value
Unit
Analog and power pins: AVIN, PVIN, SW, PG, INTB, FB
VA
−0.3 to + 6.0
V
Digital pins: SCL, SDA, EN, VSEL, Pin:
Input Voltage
Input Current
Human Body Model (HBM) ESD Rating are (Note 1)
VDG
IDG
ESD
HBM
−0.3 to VA +0.3 ≤ 6.0
V
10
mA
2500
V
Charged Device Model (CDM) ESD Rating are (Note 1)
ESD
1250
V
CDM
Latch Up Current: (Note 2)
Digital Pins
All Other Pins
ILU
mA
±10
±100
Storage Temperature Range
TSTG
−65 to + 150
°C
Maximum Junction Temperature
TJMAX
−40 to +150
°C
Moisture Sensitivity (Note 3)
MSL
Level 1
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
1. This device series contains ESD protection and passes the following tests:Human Body Model (HBM) ±2.5 kV per JEDEC standard:
JESD22−A114, Charged Device Model (CDM) ±1.25 kV per JEDEC standard: JESD22−C101 Class IV.
2. Latch up Current per JEDEC standard: JESD78 class II.
3. Moisture Sensitivity Level (MSL): 1 per IPC/JEDEC standard: J−STD−020A.
OPERATING CONDITIONS (Note 4)
Symbol
Parameter
Conditions
Min
Typ
Max Unit
AVIN,
PVIN
Power Supply
2.3
5.5
V
TA
TJ
RqJA
PD
PD
L
Ambient Temperature Range
−40
25
+85
°C
Junction Temperature Range (Note 5)
−40
25
+125
°C
Thermal Resistance Junction to Ambient (Note 6)
CSP−20 on Demo−board
−
55
−
°C/W
Power Dissipation Rating (Note 7)
Power Dissipation Rating (Note 7)
Inductor for DCDC converter (Note 4)
TA ≤ 85°C
TA = 65°C
−
727
−
mW
−
1090
−
mW
−
0.47
−
mH
Co
Output Capacitor for DCDC Converter (Note 4)
30
−
150
mF
Cin
Input Capacitor for DCDC Converter (Note 4)
4.7
−
−
mF
Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond
the Recommended Operating Ranges limits may affect device reliability.
4. Including de−ratings (Refer to the Application Information section of this document for further details)
5. The thermal shutdown set to 150°C (typical) avoids potential irreversible damage on the device due to power dissipation.
6. The RqJA is dependent of the PCB heat dissipation. Board used to drive this data was a NCP6335EVB board. It is a multilayer board with
1−once internal power and ground planes and 2−once copper traces on top and bottom of the board.
7. The maximum power dissipation (PD) is dependent by input voltage, maximum output current and external components selected.
RqJA
+
125 *
PD
TA
www.onsemi.com
4
Share Link: 