GL6ZV27 Просмотр технического описания (PDF) - Sharp Electronics

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GL6ZV27

DEVICE SPECIFICATION FOR Light Emitting Diode

Sharp Electronics 

Do6046

iMODEL No.

I

GL6ZV27

Jud16/99

PAGE

I lO/lO

7 - 3. Soldering Conditions

Solder the lead pins under the following conditions

Type of Soldering 1

Conditions

I 1. Manual soldering

295”C*YC, within 3 seconds

2. Wave soldering

26O”c+5‘C. within 5 seconds

3. Auto soldering

Preheating 70°C to 80°C. within 30 seconds

Soldering 245”c+5”c, within 5 seconds

(Note) Avoid dipping resin into soldering bath.

Avoid applying stress to lead pins while they are heated-For example ,

when the LED lamp is moved with the heat applied to the lead pins during

manual soldering or solder repair,disconnection mayoccur.

7 - 4. For cleaning

( 1) Solvent cleaning : Solvent temperature 45°C or less

Immersion for 3 min or less

(2) Ultrasonic cleaning : The effect to device by ultrasonic cleaning differs

by cleaning bath size,ultrasonic power

output,cleaning time,PIB size or device mounting

condition etc. Please test it in actual using condition

and confirm that doesn’t occur any defect before starting

the ultrasonic cleaning.

( 3 > Applicable solvent : Ethyl alcohol, Methyl alcohol, Isopropyl alcohol

In case when the other solvent is u&there are cases that

the packaging resin is eroded. Please use the other solvent

after thorough confirmation is performed in actual using condition.

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