GL6ZV27 Просмотр технического описания (PDF) - Sharp Electronics

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GL6ZV27

DEVICE SPECIFICATION FOR Light Emitting Diode

Sharp Electronics 

IX996046

MODEL No.

GL6ZV27

7. Precautions for use

7 - 1. Lead forming method

Avoid fowing a lead pin with the lead pin base as

a fulcrum:be sure to hold a lead pin firmly when

forming. Lead pins should be formed before soldering.

7 - 2. Notice of installation

7-Z-l installation on a P W B

&en mounting an LED lamp on a PIIB.do not apply

physical stress to the lead pins.

*The lead pin pitch should match the PYBpin-hole

pitch:absolutely avoid widening or narrowing

the lead pins.

l Ihen positioning an LED lamp,basically employ

an LEDwith tie-bar cut or use a spacer.

7-2-2 Whenan LED1 is mounted directly on a P WB

If the bottom face of an LED lamp is mounted

directly on single-sided PVBthe base of the

lead pins way be subjected to physical stress

due to PWBwarp.cutting or clinching of lead

pins. Prior to use, be sure to check that no

disconnection inside of the resin or damageto

resin etc., is found. when an LED lamp is mounted

on a double-sided PWB,theheat during soldering

affects the resin;therefore.keep the LED lamp

more that 1.6nunafloat above the PRI.

7-2-3 Installation using a holder

During an LED lamp positioning,when a holder is

used,a holder should be designed not to subject

lead pins to any undue stress.

(Note)Pay attention to the themal expansion coefficient

of the material used for the holder.Since the

holder expands and contracts due to preheat and

soldering heat, mechanical stress may be applied to

the lead pins, resulting in disconnection.

7-2-4 Installation to the case

Do not fix part C with adhesives when fixed to the

case as shown in Figure.A hole of the case should

be designed not to subject the inside of resin

to any undue stress.

Jud16/99

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