TGA1307-EPU Просмотр технического описания (PDF) - TriQuint Semiconductor

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TGA1307-EPU

Ka Band Low Noise Amplifier

TriQuint Semiconductor 

Advance Product Information

March 25, 2002

TGA1307-EPU

Assembly Process Notes

Reflow process assembly notes:

• Use AuSn (80/20) solder with limited exposure to temperatures at or above 300ŒC.

• An alloy station or conveyor furnace with reducing atmosphere should be used.

• No fluxes should be utilized.

• Coefficient of thermal expansion matching is critical for long-term reliability.

• Devices must be stored in a dry nitrogen atmosphere.

Component placement and adhesive attachment assembly notes:

• Vacuum pencils and/or vacuum collets are the preferred method of pick up.

• Air bridges must be avoided during placement.

• The force impact is critical during auto placement.

• Organic attachment can be used in low-power applications.

• Curing should be done in a convection oven; proper exhaust is a safety concern.

• Microwave or radiant curing should not be used because of differential heating.

• Coefficient of thermal expansion matching is critical.

Interconnect process assembly notes:

• Thermosonic ball bonding is the preferred interconnect technique.

• Force, time, and ultrasonics are critical parameters.

• Aluminum wire should not be used.

• Discrete FET devices with small pad sizes should be bonded with 0.0007-inch wire.

• Maximum stage temperature is 200ŒC.

GaAs MMIC devices are susceptible to damage from Electrostatic Discharge. Proper precautions should

be observed during handling, assembly and test.

TriQuint Semiconductor Texas : Phone (972)994-8465 Fax (972)994 8504 Web: www.triquint.com

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