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74HC283N Просмотр технического описания (PDF) - NXP Semiconductors.

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Компоненты Описание
Список матч
74HC283N
NXP
NXP Semiconductors. NXP
74HC283N Datasheet PDF : 20 Pages
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Philips Semiconductors
74HC283
4-bit binary full adder with fast carry
3. Quick reference data
Table 1: Quick reference data
GND = 0 V; Tamb = 25 °C; tr = tf = 6 ns.
Symbol Parameter
Conditions
Min Typ
tPHL, tPLH propagation delay
CL = 15 pF; VCC = 5 V
CIN to S1
-
16
CIN to S2
-
18
CIN to S3
-
20
CIN to S4
-
23
An or Bn to Sn
-
21
CIN to COUT
-
20
An or Bn to COUT
-
20
CI
input capacitance
-
3.5
CPD
power dissipation
VI = GND to VCC
[1] -
88
capacitance
[1] CPD is used to determine the dynamic power dissipation (PD in µW).
PD = CPD × VCC2 × fi × N + (CL × VCC2 × fo) where:
fi = input frequency in MHz;
fo = output frequency in MHz;
CL = output load capacitance in pF;
VCC = supply voltage in V;
N = number of inputs switching;
(CL × VCC2 × fo) = sum of outputs.
4. Ordering information
Max Unit
-
ns
-
ns
-
ns
-
ns
-
ns
-
ns
-
ns
-
pF
-
pF
Table 2: Ordering information
Type number Package
Temperature range
74HC283N
40 °C to +125 °C
74HC283D
40 °C to +125 °C
74HC283DB
40 °C to +125 °C
74HC283PW 40 °C to +125 °C
Name
DIP16
SO16
SSOP16
TSSOP16
Description
plastic dual in-line package; 16 leads (300 mil)
plastic small outline package; 16 leads;
body width 3.9 mm
plastic shrink small outline package; 16 leads;
body width 5.3 mm
plastic thin shrink small outline package;
16 leads; body width 4.4 mm
Version
SOT38-4
SOT109-1
SOT338-1
SOT403-1
9397 750 13811
Product data sheet
Rev. 03 — 11 November 2004
© Koninklijke Philips Electronics N.V. 2004. All rights reserved.
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