CRHV1206 Просмотр технического описания (PDF) - Vishay Semiconductors
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CRHV1206 Datasheet PDF : 5 Pages
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www.vishay.com
CRHV
Vishay Techno
DIMENSIONS in inches (millimeters)
Termination Style A
(3-sided wraparound)
W
L
T
0.025 [0.635]
Max.
Termination Style C
(5-sided wraparound)
W
L
T
0.025 [0.635]
Max.
Termination Style B
(Top conductor only)
W
L
T
0.025 [0.635]
Max.
MODEL
CRHV1206
CRHV1210
CRHV2010
CRHV2510
CRHV2512
LENGTH (L)
± 0.006 (0.152)
0.125
0.125
0.200
0.250
0.250
WIDTH (W)
± 0.006 (0.152)
0.063
0.100
0.100
0.100
0.126
THICKNESS (T)
± 0.002 (0.051)
0.025
0.025
0.025
0.025
0.025
TYPE
TERMINATION
MATERIAL
TERMINATION
STYLE
TERMINATION STYLE/
MATERIAL CODE
SOLDER TERMINATION
CODE
3-sided (wraparound)
AF
Nickel barrier
Top only (flip chip)
BF
Solderable
5-sided (wraparound)
CF
Non-magnetic
3-sided (wraparound)
Top only (flip chip)
AG
BG
3-sided (wraparound)
AE
Epoxy bondable/
solderable
Platinum palladium gold
Top only (flip chip)
BE
5-sided (wraparound)
CE
3-sided (wraparound)
AC
Wire bondable/
Epoxy bondable
Gold
Top only (flip chip)
BC
5-sided (wraparound)
CC
3-sided (wraparound)
AA
Palladium silver (2)
Top only (flip chip)
BA
5-sided (wraparound)
CA
3-sided (wraparound)
AB
Epoxy bondable
Platinum gold
Top only (flip chip)
BB
5-sided (wraparound)
CB
3-sided (wraparound)
AD
Platinum silver
Top only (flip chip)
BD
5-sided (wraparound)
CD
E or T (standard);
F or S (optional) (3)
E or T (standard);
F or S (optional) (3)
N (standard);
F or S (optional) (1)
N
N
Notes
(1) Use solder termination N for applications requiring epoxy bondable mounting, and solder terminations F or S for applications requiring
solderable mounting
(2) While not recommended, palladium silver terminations could be used for solderable applications when using a solder alloy containing silver.
If the solder paste being used to solder the palladium silver terminated parts to the boards does not have a silver-based composition, then
the silver in the terminations could begin to leach when it is exposed to liquidus non-silver-based solders, causing the potential for
solderability and/or solder joint issues
(3) Standard solder plating for the nickel barrier and non-magnetic parts is solder terminations E or T. Hot solder dipped terminations F or S are
also available
PERFORMANCE
TEST
CONDITIONS OF TEST
Life
High temperature exposure
Low temperature operation
Resistance to bonding exposure
Moisture resistance
Solder mounting integrity
Solderability
MIL-STD-202, method 108, 1000 h rated power at +70 °C
MIL-STD-202, method 108
MIL-PRF-55342, paragraph 4.8.5
MIL-STD-202, methods 210
MIL-PRF-55342, paragraph 4.8.9
MIL-PRF-55342, paragraph 4.8.13, 2 kg for 30 s
MIL-STD-202, method 208
Note
• This summary is based on testing done on values up to 2 G
TEST RESULTS
(TYPICAL TEST LOTS)
± 0.5 %
± 0.2 %
± 0.05 %
± 0.1 %
± 0.06%
No evidence of mechanical damage
95 % coverage
Revision: 18-Apr-17
3
Document Number: 68002
For technical questions, contact: te1resistors@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
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