BAT54(2006) Просмотр технического описания (PDF) - STMicroelectronics

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BAT54
(Rev.:2006)

Small signal Schottky diodes

STMicroelectronics 

Characteristics

BAT54 Series

Figure 7.

Thermal resistance junction to

ambient versus copper surface

under each lead - epoxy FR4 with

recommended pad layout,

eCU = 35 µm (SOD-323)

Rth(j-a)(°C/W)

600

500

Epoxy FR4

eCU=35 µm

400

300

200

0

SCU(mm²)

5 10 15 20 25 30 35 40 45 50

Figure 8.

Relative variation of thermal

impedance junction to ambient

versus pulse duration - epoxy FR4

with recommended pad layout,

eCU = 35 µm (SOD-323)

Zth(j-a)/Rth(j-a)

1.E+00

Single pulse

SOD323

1.E-01

1.E-02

1.E-03

1.E-03

1.E-02

1.E-01

tP(s)

Epoxy FR4

SCU=2.25 mm²

eCU=35 µm

1.E+00 1.E+01 1.E+02 1.E+03

Figure 9.

Relative variation of thermal

impedance junction to ambient

versus pulse duration -

aluminium oxide substrate

10 mm x 8 mm x 0.5 mm (SOT-23)

Zth(j-a)/Rth(j-a)

1.E+00

Single pulse

SOT23

Figure 10.

Relative variation of thermal

impedance junction to ambient

versus pulse duration - epoxy FR4

with recommended pad layout,

eCU = 35 µm (SOD-523)

Zth(j-a)/Rth(j-a)

1.E+00

Single pulse

SOD523

1.E-01

1.E-02

1.E-03

1.E-02

tP(s)

1.E-01

Alumine substrate

10 x 8 x 0.5 mm

1.E+00 1.E+01 1.E+02

1.E-01

1.E-02

1.E-03

1.E-03

1.E-02

tP(s)

1.E-01

Epoxy FR4

eCU=35 µm

1.E+00

1.E+01

Figure 11.

Relative variation of thermal

impedance junction to ambient

versus pulse duration - epoxy FR4

with recommended pad layout,

eCU = 35 µm (SOT-666)

Zth(j-a)/Rth(j-a)

1.E+00

Single pulse

SOT666

1.E-01

1.E-02

1.E-03

1.E-02

tP(s)

1.E-01

Epoxy FR4

eCU=35 µm

1.E+00

1.E+01

4/13

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