MP6211DH-LF Просмотр технического описания (PDF) - Monolithic Power Systems

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MP6211DH-LF

3.3V/5V, Single-Channel 1A Current-Limited Power Distribution Switches

Monolithic Power Systems 

MP6211/MP6212 –CURRENT-LIMITED POWER DISTRIBUTION SWITCHES

ORDERING INFORMATION

Part Number*

MP6211DN

MP6211DH

MP6212DN

MP6212DH

Enable

Active

High

Active

High

Active

Low

Active

Low

Maximum Typical Short-

Switch Continuous Circuit Current Package

Load Current @ TA=25C

Single

1.0A

1.5A

SOIC8E

Single

1.0A

1.5A

MSOP8E

Single

1.0A

1.5A

SOIC8E

Single

1.0A

1.5A

MSOP8E

Top

Marking

Temperature

6211D

–40°C to +85°C

6212D

* For Tape & Reel, add suffix –Z (eg. MP6211_MP6212DN–Z). For RoHS Compliant Packaging, add suffix –LF.

(eg. MP6211_MP6212DN–LF–Z)

PACKAGE REFERENCE

TOP VIEW

GND 1

IN 2

IN 3

EN* 4

8 NC

7 OUT

6 OUT

5 FLAG

EXPOSED PAD

ON BACKSIDE

MP6211_MP6212

Single-Channel

(* EN is active high for MP6211)

ABSOLUTE MAXIMUM RATINGS (1)

IN .................................................-0.3V to +6.0V

EN, FLAG, OUT to GND ..............-0.3V to +6.0V

Continuous Power Dissipation. (TA = +25°C) (2)

SOIC8E...................................................... 2.5W

MSOP8E .................................................... 2.3W

Junction Temperature ...............................150°C

Lead Temperature ....................................260°C

Storage Temperature...............–65°C to +150°C

Operating Temperature..............–40°C to +85°C

Thermal Resistance (3) θJA θJC

SOIC8E .................................. 50 ...... 10... °C/W

MSOP8E................................. 55 ...... 12... °C/W

Notes:

1) Exceeding these ratings may damage the device.

2) The maximum allowable power dissipation is a function of the

maximum junction temperature TJ (MAX), the junction-to-

ambient thermal resistance θJA, and the ambient temperature

TA. The maximum allowable continuous power dissipation at

any ambient temperature is calculated by PD (MAX) = (TJ

(MAX)-TA)/θJA. Exceeding the maximum allowable power

dissipation will cause excessive die temperature, and the

regulator will go into thermal shutdown. Internal thermal

shutdown circuitry protects the device from permanent

damage.

3) Measured on JESD51-7 4-layer PCB.

MP6211_MP6212 Rev. 1.1

www.MonolithicPower.com

2

9/18/2009

MPS Proprietary Information. Unauthorized Photocopy and Duplication Prohibited.

© 2009 MPS. All Rights Reserved.

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