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CS8312 Просмотр технического описания (PDF) - Cherry semiconductor

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CS8312 Datasheet PDF : 5 Pages
1 2 3 4 5
Package Specification
PACKAGE DIMENSIONS IN mm (INCHES)
PACKAGE THERMAL DATA
Lead Count
8 Lead SO Narrow
8 Lead PDIP
Metric
Max Min
5.00 4.80
10.16 9.02
D
English
Max Min
.197 .189
.400 .355
Thermal Data
RQJC
typ
RQJA
typ
8L SO
45
165
8L PDIP
52
100
ûC/W
ûC/W
Surface Mount Narrow Body (D); 150 mil wide
4.00 (.157)
3.80 (.150)
6.20 (.244)
5.80 (.228)
0.51 (.020)
0.33 (.013)
1.27 (.050) BSC
1.27 (.050)
0.40 (.016)
0.25 (.010)
0.19 (.008)
1.57 (.062)
1.37 (.054)
REF: JEDEC MS-012
Plastic DIP (N); 300 mil wide
1.75 (.069) MAX
0.25 (0.10)
0.10 (.004)
D
7.11 (.280)
6.10 (.240)
3.68 (.145)
2.92 (.115)
8.26 (.325)
7.62 (.300)
1.77 (.070)
1.14 (.045)
2.54 (.100) BSC
.356 (.014)
.203 (.008)
REF: JEDEC MS-001
0.39 (.015)
MIN.
.558 (.022)
.356 (.014)
D
Some 8 and 16 lead
packages may have
1/2 lead at the end
of the package.
All specs are the same.
Ordering Information
Part Number
CS8312YN8
CS8312YD8
CS8312YDR8
Description
8L PDIP
8L SO Narrow
8L SO Narrow (tape & reel)
Cherry Semiconductor Corporation reserves the
right to make changes to the specifications without
notice. Please contact Cherry Semiconductor
Corporation for the latest available information.
Rev. 4/7/97
5
© 1999 Cherry Semiconductor Corporation

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