CXD1948R Просмотр технического описания (PDF) - Sony Semiconductor

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CXD1948R

IEEE1394 Link Layer LSI for DVB and DSS

Sony Semiconductor 

Package Outline

Unit: mm

75

76

100PIN LQFP (PLASTIC)

16.0 ± 0.2

∗ 14.0 ± 0.1

51

50

CXD1948R

100

1

0.5 ± 0.08

+ 0.08

0.18 – 0.03

0.1 ± 0.1

A

26 (0.22)

25

+ 0.2

1.5 – 0.1

+ 0.05

0.127 – 0.02

0.1

0° to 10°

NOTE: Dimension “∗” does not include mold protrusion.

SONY CODE

EIAJ CODE

JEDEC CODE

DETAIL A

LQFP-100P-L01

∗QFP100-P-1414-A

PACKAGE STRUCTURE

PACKAGE MATERIAL EPOXY/PHENOL RESIN

LEAD TREATMENT

SOLDER PLATING

LEAD MATERIAL

42 ALLOY

PACKAGE WEIGHT

– 78 –

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