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MAS1175AASM1-T

IC FOR 10.00 – 20.00 MHz VCTCXO

Micro Analog Systems Oy 

PIN DESCRIPTION

DA1175.005

26 March, 2002

Pin Description

Symbol

x-coordinate

y-coordinate

Power Supply Voltage

Programming Input

Serial Bus Clock Input

VDD

263

PV

503

CLK

745

1330

1326

1321

Serial Bus Data Input

DA

1001

1321

Temperature Output

TE1

1246

1325

Test Multiplexer Output

TE2

1454

1325

Voltage Control Input

VC

190

231

Crystal Oscillator Output

X1

398

231

Crystal/Varactor Oscillator Input

X2

1355

231

Power Supply Ground

VSS

1828

242

Buffer Output

OUT

2031

231

Note: Because the substrate of the die is internally connected to VDD, the die has to be connected to VDD or

left floating. Make sure that VDD is the first pad to be bonded. Pick-and-place and all component assembly are

recommended to be performed in ESD protected area.

Note: Pad coordinates are measured from the left bottom corner of the chip to the center of the pads. The

coordinates may vary depending on sawing width and location, however, distances between pads are accurate.

ABSOLUTE MAXIMUM RATINGS

Parameter

Supply Voltage

Input Voltage

Power Dissipation

Storage Temperature

Note: Not valid for programming pin PV

Symbol

VDD - VSS

VIN

PMAX

TST

Min

-0.3

VSS -0.3

-40

Max

6.0

VDD + 0.3

20

120

Unit

V

V

mW

oC

Note

1)

RECOMMENDED OPERATION CONDITIONS

Parameter

Supply Voltage

Supply Current

Operable Temperature

Storage Temperature

Crystal Pulling Sensitivity

Load Capacitance

Symbol

VDD

ICC

TC

TS

S

CL

Conditions

Vcc = 2.8 Volt

Relative humidity =

15%…70%

Min Typ Max Unit

2.7 2.8 5.5

V

1.8

mA

-30

+85

oC

-5

+40

oC

30

ppm/pF

10

pF

2 (8)

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