HMC256(V02) Просмотр технического описания (PDF) - Hittite Microwave

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HMC256
(Rev.:V02)

GaAs MMIC I/Q MIXER 5.9 - 12 GHz

Hittite Microwave 

v02.1103

MICROWAVE CORPORATION

Absolute Maximum Ratings

RF / IF Input

+13 dBm

LO Drive

+27 dBm

Channel Temperature

150 °C

Continuous Pdiss (T = 85 °C)

(derate 9.36 mW/°C above 85 °C)

0.61 W

Thermal Resistance (RTH)

(junction to die bottom)

106.8 °C/W

Storage Temperature

-65 to +150 °C

Operating Temperature

-55 to +85 °C

Outline Drawing

HMC256

GaAs MMIC I/Q MIXER

5.9 - 12 GHz

5

NOTES:

1. ALL DIMENSIONS ARE IN INCHES [MM].

2. BOND PADS ARE .004” SQUARE.

3. TYPICAL BOND PAD SPACING CENTER TO CENTER IS .006”.

4. BACKSIDE METALLIZATION: GOLD.

5. BOND PAD METALLIZATION: GOLD.

6. BACKSIDE METAL IS GROUND.

7. CONNECTION NOT REQUIRED FOR UNLABELED BOND PADS.

For price, delivery, and to place orders, please contact Hittite Microwave Corporation:

12 Elizabeth Drive, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373

Order Online at www.hittite.com

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