MAX1714(1999) Просмотр технического описания (PDF) - Maxim Integrated
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MAX1714 Datasheet PDF : 24 Pages
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High-Speed Step-Down Controller
for Notebook Computers
ABSOLUTE MAXIMUM RATINGS
V+ to AGND (Note 1)..............................................-0.3V to +30V
VDD, VCC to AGND (Note 1) .....................................-0.3V to +6V
PGND to AGND (Note 1) ................................................... ±0.3V
SHDN, PGOOD, OUT to AGND (Note 1)..................-0.3V to +6V
ILIM, FB, REF, SKIP,
TON to AGND (Notes 1, 2)....................-0.3V to (VCC + 0.3V)
DL to PGND (Note 1)..................................-0.3V to (VDD + 0.3V)
BST to AGND (Note 1) ...........................................-0.3V to + 36V
DH to LX.....................................................-0.3V to (BST + 0.3V)
LX to BST..................................................................-6V to +0.3V
REF Short Circuit to AGND.........................................Continuous
Continuous Power Dissipation (TA = +70°C)
16-Pin QSOP (derate 8.3mW/°C above +70°C)..........667mW
20-Pin QSOP (derate 9.1mW/°C above +70°C)..........727mW
Operating Temperature Range ..........................-40°C to +85°C
Junction Temperature ......................................................+150°C
Storage Temperature Range ............................-65°C to +150°C
Lead Temperature (soldering, 10s) .................................+300°C
Note 1: For the MAX1714B, AGND and PGND refer to a single pin designated GND.
Note 2: SKIP may be forced below -0.3V, temporarily exceeding the absolute maximum rating, disabling over/undervoltage fault
detection for the purpose of debugging prototypes (Figure 6). Limit the current drawn to 5mA maximum.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
ELECTRICAL CHARACTERISTICS
(Circuit of Figure 1, 4A components from Table 1, V+ = +15V, VCC = VDD = +5V, SKIP = AGND, TA = 0°C to +85°C, unless otherwise
noted.) (Note 1)
PARAMETER
CONDITIONS
MIN TYP MAX UNITS
Input Voltage Range
Battery voltage, V+
VCC, VDD
2
28
V
4.5
5.5
Error Comparator Threshold
(DC Output Voltage Accuracy)
(Note 3)
Load Regulation Error
V+ = 4.5V to 28V,
SKIP = VCC
ILOAD = 0 to 3A, SKIP = VCC
FB = OUT
FB = AGND
FB = VCC
0.99
1.0
1.01
2.475 2.5 2.525
V
3.267 3.3 3.333
9
mV
Line Regulation Error
VCC = 4.5V to 5.5V, V+ = 4.5V to 28V
5
mV
FB Input Bias Current
-0.1
0.1
µA
OUT Input Resistance
FB = AGND
100
190
300
kΩ
Soft-Start Ramp Time
On-Time
Rising edge of SHDN to full ILIM
TON = AGND (600kHz)
V+ = 24V,
VOUT = 2V
(Note 4)
TON = REF (450kHz)
TON = unconnected (300kHz)
TON = VCC (200kHz)
1.7
ms
140
160
180
175
200
225
ns
260
290
320
380
425
470
Minimum Off-Time
(Note 4)
400
500
ns
Quiescent Supply Current (VCC) FB forced above the regulation point
550
750
µA
Quiescent Supply Current (VDD) FB forced above the regulation point
<1
5
µA
Quiescent Supply Current (V+)
25
40
µA
Shutdown Supply Current (VCC) V SHDN = 0
<1
5
µA
Shutdown Supply Current (VDD) V SHDN = 0
<1
5
µA
Shutdown Supply Current (V+) V SHDN = 0 , V+ = 28V, VCC = VDD = 0 or 5V
<1
5
µA
Reference Voltage
VCC = 4.5V to 5.5V, no external REF load
1.98
2
2.02
V
Reference Load Regulation
IREF = 0 to 50µA
0.01
V
REF Sink Current
REF in regulation
10
µA
REF Fault Lockout Voltage
Falling edge, hysteresis = 40mV
1.6
V
2 _______________________________________________________________________________________
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