EP7309-EB-C Просмотр технического описания (PDF) - Cirrus Logic

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EP7309-EB-C

High-Performance, Low-Power System on Chip Enhanced Digital Audio Interface

Cirrus Logic 

Packages

208-Pin LQFP Package Characteristics

208-Pin LQFP Package Specifications

29.60 (1.165)

30.40 (1.197)

27.80 (1.094)

28.20 (1.110)

EP7309

High-Performance, Low-Power System on Chip

0.17 (0.007)

0.27 (0.011)

29.60 (1.165)

30.40 (1.197)

0.50

(0.0197)

BSC

Pin 208

Pin 1

EP7309

208-Pin LQFP

Pin 1 Indicator

27.80 (1.094)

28.20 (1.110)

0.45 (0.018)

0.75 (0.030)

1.35 (0.053)

1.45 (0.057)

1.00 (0.039) BSC

0.09 (0.004)

0.20 (0.008)

1.40 (0.055)

1.60 (0.063)

0.05 (0.002)

0.15 (0.006)

0° MIN

7° MAX

Figure 10. 208-Pin LQFP Package Outline Drawing

Note:

1) Dimensions are in millimeters (inches), and controlling dimension is millimeter.

2) Drawing above does not reflect exact package pin count.

3) Before beginning any new design with this device, please contact Cirrus Logic for the latest package information.

4) For pin locations, please see Figure 11. For pin descriptions see the EP7309 User’s Manual.

DS507PP1

Copyright 2001 Cirrus Logic (All Rights Reserved)

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