XE2420G Просмотр технического описания (PDF) - Unspecified

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XE2420G

Smallest World-Wide 2400 BPS Modem

Unspecified 

XE2420G Soldering Instructions

The XE2420G is subject to damage if over-exposed to heat during solder reflow operations. Following the soldering

instructions below will ensure that the process of soldering the module to the board does not damage the modem.

The XE2420G must not be exposed to direct Infrared (IR) heating. If your process includes direct IR heating, you

must shield the XE2420G from the infrared rays.

Maximum Temperature

Maximum Time at 220O C

Maximum Time above Eutectic (180O C)

Maximum Preheat Dwell Time

220O C

20 Seconds

90 Seconds

180 Seconds

220O C

Maximum Recommended Solder Temperature Profile

180O C

150O C

180 sec. max.

20 sec. max.

90 sec. max.

XECOM

(5)

XE2420G

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