W83L177R Просмотр технического описания (PDF) - Winbond

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W83L177R

100MHZ 2-DIMM SDRAM BUFFER FOR NOTEBOOK

Winbond 

W83L177R

10.0 PACKAGE DRAWING AND DIMENSIONS

PRELIMINARY

28-SOP

D

2

HE E

1

SEATING PLANE

Y

e

b

15

DIMENSION IN MM DIMENSION IN INCH

SYMBOL

MIN. NOM MAX. MIN. NOM MAX.

A

2.00

0.079

DTEAIL A

A1 0.05

0.002

A2 1.65 1.75 1.85 0.065 0.069 0.073

b 0.22

0.38 0.009

0.015

c 0.09

0.25 0.004

0.010

D 9.90 10.20 10.50 0.389 0.401 0.413

E 5.00 5.30 5.60 0.197 0.209 0.220

HE 7.40 7.80 8.20 0.291 0.307 0.323

e

0.65

0.0256

L 0.55 0.75 0.95 0.021 0.030 0.037

L1

1.25

0.050

Y

0.10

0.004

14

θ

0

8

0

8

A2 A

A1

θL

DETAIL A L1

SEATING PLANE

Headquarters

No. 4, Creation Rd. III

Science-Based Industrial Park

Hsinchu, Taiwan

TEL: 886-35-770066

FAX: 886-35-789467

www: http://www.winbond.com.tw/

Taipei Office

11F, No. 115, Sec. 3, Min-Sheng East Rd.

Taipei, Taiwan

TEL: 886-2-7190505

FAX: 886-2-7197502

TLX: 16485 WINTPE

Winbond Electronics (H.K.) Ltd.

Rm. 803, World Trade Square, Tower II

123 Hoi Bun Rd., Kwun Tong

Kowloon, Hong Kong

TEL: 852-27516023-7

FAX: 852-27552064

Winbond Electronics

(North America) Corp.

2730 Orchard Parkway

San Jose, CA 95134 U.S.A.

TEL: 1-408-9436666

FAX: 1-408-9436668

Please note that all data and specifications are subject to change without notice. All the

trade marks of products and companies mentioned in this data sheet belong to their

respective owners.

These products are not designed for use in life support appliances, devices, or systems

where malfunction of these products can reasonably be expected to result in personal

injury. Winbond customers using or selling these products for use in such applications

do so at their own risk and agree to fully indemnify Winbond for any damages resulting

from such improper use or sale.

Publication Release Date: Mar. 1999

-9-

Revision 0.10

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