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RMPA29000 Просмотр технического описания (PDF) - Fairchild Semiconductor

Номер в каталоге
Компоненты Описание
Список матч
RMPA29000
Fairchild
Fairchild Semiconductor Fairchild
RMPA29000 Datasheet PDF : 10 Pages
1 2 3 4 5 6 7 8 9 10
2 MIL GAP
5 MIL THICK
ALUMINA
50
RF INPUT
Vg (NEGATIVE)
Vd (POSITIVE)
10000pF
10000pF
100pF
100pF
DIE-ATTACH
80Au/20Sn
5 MIL THICK
ALUMINA
50
RF OUTPUT
100pF
100pF
10000pF
10000pF
L < 0.015"
(4 Places)
Vg (NEGATIVE)
Vd (POSITIVE)
Note:
Use 0.003" by 0.0005" Gold Ribbon for bonding. RF input and output bonds should be less than 0.015" long with stress relief.
Vd should be biased from 1 supply on both sides as shown. Vg can be biased from either or both sides from 1 supply.
Figure 4. Recommended Assembly and Bonding Diagram
©2004 Fairchild Semiconductor Corporation
RMPA29000 Rev. D

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