2 MIL GAP
5 MIL THICK
ALUMINA
50Ω
RF INPUT
Vg (NEGATIVE)
Vd (POSITIVE)
10000pF
10000pF
100pF
100pF
DIE-ATTACH
80Au/20Sn
5 MIL THICK
ALUMINA
50Ω
RF OUTPUT
100pF
100pF
10000pF
10000pF
L < 0.015"
(4 Places)
Vg (NEGATIVE)
Vd (POSITIVE)
Note:
Use 0.003" by 0.0005" Gold Ribbon for bonding. RF input and output bonds should be less than 0.015" long with stress relief.
Vd should be biased from 1 supply on both sides as shown. Vg can be biased from either or both sides from 1 supply.
Figure 4. Recommended Assembly and Bonding Diagram
©2004 Fairchild Semiconductor Corporation
RMPA29000 Rev. D