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IRF9620 Просмотр технического описания (PDF) - Intersil

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IRF9620 Datasheet PDF : 7 Pages
1 2 3 4 5 6 7
IRF9620
Absolute Maximum Ratings TC = 25oC, Unless Otherwise Specified
Drain to Source Breakdown Voltage (Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . VDS
Drain to Gate Voltage (RGS = 20kΩ) (Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . VDGR
Continuous Drain
TC = 100oC . .
Current
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ID
ID
Pulsed Drain Current (Note 3) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . IDM
Gate to Source Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . VGS
Maximum Power Dissipation (Figure 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . PD
Linear Derating Factor (Figure 1). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Single Pulse Avalanche Energy Rating (Note 4). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . EAS
Operating and Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .TJ, TSTG
Maximum Temperature for Soldering
Leads at 0.063in (1.6mm) from Case for 10s. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . TL
Package Body for 10s, See Techbrief 334 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Tpkg
IRF9620
-200
-200
-3.5
-2
-14
±20
40
0.32
290
-55 to 150
300
260
UNITS
V
V
A
A
A
V
W
W/oC
mJ
oC
oC
oC
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTE:
1. TJ = 25oC to TJ = 125oC.
Electrical Specifications TC = 25oC, Unless Otherwise Specified
PARAMETER
SYMBOL
TEST CONDITIONS
Drain to Source Breakdown Voltage
Gate Threshold Voltage
Zero Gate Voltage Drain Current
On-State Drain Current (Note 2)
Gate to Source Leakage Current
Drain to Source On Resistance (Note 2)
Forward Transconductance (Note 2)
BVDSS
VGS(TH)
IDSS
ID(ON)
IGSS
rDS(ON)
gfs
ID = -250µA, VGS = 0V, (Figure 10)
VGS = VDS, ID = -250µA
VDS = Rated BVDSS, VGS = 0V
VDS = 0.8 x Rated BVDSS, VGS = 0V, TC =125oC
VDS > ID(ON) x rDS(ON)MAX, VGS = -10V
VGS = ±20V
ID = -1.5A, VGS = -10V, (Figures 8, 9)
VDS > ID(ON) x rDS(ON)MAX, ID = -1.5A,
(Figure 12)
Turn-On Delay Time
Rise Time
Turn-Off Delay Time
Fall Time
Total Gate Charge
(Gate to Source + Gate to Drain)
Gate to Source Charge
Gate to Drain “Miller” Charge
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Internal Drain Inductance
Internal Source Inductance
td(ON)
tr
td(OFF)
tf
Qg(TOT)
Qgs
Qgd
CISS
COSS
CRSS
LD
LS
VDD = 0.5 x Rated BVDSS, ID -3.5A, RG = 50Ω,
RL = 26, for BVDSS = 200V
RL = 20for BVDSS = 150V
(Figures 17, 18) MOSFET Switching Times are
Essentially Independent of Operating Temperature
VGS = -10V, ID = -3.5A, VDS = 0.8 x Rated BVDSS,
IG(REF) = 1.5mA, (Figures 14, 19, 20)
Gate Charge is Essentially Independent of
Operating Temperature
VDS = -25V, VGS = 0V, f = 1MHz, (Figure 11)
Measured From the
Contact Screw on Tab To
Center of Die
Measured From the Drain
Lead, 6mm (0.25in) from
Package to Center of Die
Measured From the
Source Lead, 6mm
(0.25in) from Header to
Source Bonding Pad
Modified MOSFET
Symbol Showing the
Internal Devices
Inductances
D
LD
G
LS
S
Thermal Resistance Junction to Case
Thermal Resistance Junction to Ambient
RθJC
RθJA
Typical Socket Mount
MIN
-200
-2
-
-
-3.5
-
-
1
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
TYP
-
-
-
-
-
-
1.000
1.8
MAX
-
-4
-25
-250
-
±100
1.500
-
UNITS
V
V
µA
µA
A
nA
S
30
50
ns
50
100
ns
80
120
ns
50
75
ns
16
22
nC
9
-
nC
7
-
nC
350
-
pF
100
-
pF
30
-
pF
3.5
-
nH
4.5
-
nH
7.5
-
nH
-
3.12 oC/W
-
80 oC/W
4-22

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