HMC260(V01) Просмотр технического описания (PDF) - Hittite Microwave
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HMC260 Datasheet PDF : 6 Pages
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v01.0301
MICROWAVE CORPORATION
Absolute Maximum Ratings
RF / IF Input
LO Drive
Storage Temperature
Operating Temperature
IF DC Current
+15 dBm
+27 dBm
-65 to +150 °C
-55 to +85 °C
±4 mA
HMC260
GaAs MMIC FUNDAMENTAL
MIXER, 14 - 26 GHz
5
Outline Drawing (See Handling Mounting Bonding Note)
NOTES:
1. ALL DIMENSIONS ARE IN INCHES [MM].
2. DIE THICKNESS IS .004”.
3. TYPICAL BOND PAD IS .004” SQUARE.
4. BOND PAD SPACING CENTER TO CENTER IS .006”.
5. BACKSIDE METALLIZATION: GOLD.
6. BOND PAD METALLIZATION: GOLD.
7. BACKSIDE METAL IS GROUND.
8. CONNECTION NOT REQUIRED FOR UNLABELED BOND PADS.
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
12 Elizabeth Drive, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order Online at www.hittite.com
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