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HPDL-2416 Просмотр технического описания (PDF) - HP => Agilent Technologies

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HPDL-2416
HP
HP => Agilent Technologies HP
HPDL-2416 Datasheet PDF : 12 Pages
First Prev 11 12
Soldering and Post Solder
Cleaning Instructions
The HPDL-1414/2416 may be
hand soldered or wave soldered
with SN63 solder. Hand soldering
may be safely performed only
with an electronically
temperature-controlled and
securely grounded soldering iron.
For best results, the iron tip
temperature should be set at
315°C (600°F). For wave
soldering, a rosin-based RMA flux
can be used. The solder wave
temperature should be
245°C ± 5°C (473°F ± 9°F),
and the dwell in the wave should
be set at 11/2 to 3 seconds for
optimum soldering. Preheat
temperature should not exceed
93°C (200°F) as measured on the
solder side of the PC board.
For further information on
soldering and post solder
cleaning, see Application Note
1027, Soldering LED
Components.
3-186

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