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BAP50-02(2008) Просмотр технического описания (PDF) - NXP Semiconductors.

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Компоненты Описание
Список матч
BAP50-02
(Rev.:2008)
NXP
NXP Semiconductors. NXP
BAP50-02 Datasheet PDF : 7 Pages
1 2 3 4 5 6 7
NXP Semiconductors
General purpose PIN diode
GRAPHICAL DATA
103
handbook, halfpage
rD
()
102
MLD601
600
handbook, halfpage
Cd
(fF)
400
Product specification
BAP50-02
MLD602
10
200
1
101
1
10
102
IF (mA)
f = 100 MHz; Tj = 25 °C.
Fig.2 Forward resistance as a function of
forward current; typical values.
0
0
4
8
12
16
20
VR (V)
f = 1 MHz; Tj = 25 °C.
Fig.3 Diode capacitance as a function of
reverse voltage; typical values.
handbook, h0alfpage
s21 2
(1)
(dB)
1
(2)
2
(3)
3
MLD603
4
5
0.5
1
1.5
2
2.5
3
f (GHz)
(1) IF = 10 mA.
(2) IF = 1 mA.
(3) IF = 0.5 mA.
Diode inserted in series with a 50 stripline circuit and
biased via the analyzer Tee network.
Tamb = 25 °C.
Fig.4 Insertion loss |s21|2 of the diode in on-state
as a function of frequency; typical values.
handbook, h0alfpage
s21 2
(dB)
5
MLD604
10
15
20
25
0.5
1
1.5
2
2.5
3
f (GHz)
Diode zero biased and inserted in series with a 50 stripline circuit.
Tamb = 25 °C.
Fig.5 Isolation (|s21|2) of the diode in off-state as a
function of frequency; typical values.
Rev. 02 - 3 January 2008
4 of 7

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