ADT7411ARQZ10 Просмотр технического описания (PDF) - Analog Devices
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ADT7411ARQZ10
Analog Devices
ADT7411ARQZ10 Datasheet PDF : 36 Pages
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ABSOLUTE MAXIMUM RATINGS
Table 2.
Parameter
Rating
VDD to GND
Analog Input Voltage to GND
Digital Input Voltage to GND
Operating Temperature Range
Storage Temperature Range
Junction Temperature
16-Lead QSOP Package
Power Dissipation8
Thermal Impedance9
−0.3 V to +7 V
−0.3 V to VDD + 0.3 V
−0.3 V to VDD + 0.3 V
−40°C to +120°C
−65°C to +150°C
150°C
(TJmax − TA)/θJA
θJA Junction-to-Ambient
θJC Junction-to-Case
IR Reflow Soldering
Peak Temperature
Time at Peak Temperature
Ramp-Up Rate
Ramp-Down Rate
105.44°C/W
38.8°C/W
220°C (0°C/5°C)
10 sec to 20 sec
2°C/sec to 3°C/sec
−6°C/sec
ADT7411
Table 3. I2C Address Selection
ADD Pin
I2C Address
Low
1001 000
Float
1001 010
High
1001 011
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
8 Values relate to package being used on a 4-layer board
9 Junction-to-case resistance is applicable to components featuring a
preferential flow direction, e.g., components mounted on a heat sink.
Junction-to-ambient resistance is more useful for air-cooled PCB-mounted
components.
ESD CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on
the human body and test equipment and can discharge without detection. Although this product features
proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy
electro-static discharges. Therefore, proper ESD precautions are recommended to avoid performance
degradation or loss of functionality.
Rev. A | Page 7 of 36
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