Die Characteristics
DIE DIMENSIONS:
69 mils x 92 mils
1750µm x 2330µm
METALLIZATION:
Type: Metal 1: AICu (2%)/TiW
Thickness: Metal 1: 8kÅ ± 0.4kÅ
Type: Metal 2: AICu (2%)
Thickness: Metal 2: 16kÅ ± 0.8kÅ
Metallization Mask Layout
HFA1205
SUBSTRATE POTENTIAL (POWERED UP):
Floating (Recommend Connection to V-)
PASSIVATION:
Type: Nitride
Thickness: 4kÅ ± 0.5kÅ
TRANSISTOR COUNT:
180
HFA1205
-IN1
OUT1 NC
NC
+IN1
NC
NC
V-
V+
OUT2
-IN2
NC
NC
+IN2
13